■A new, thermal cure version of our surface-flattening UCP Series material has been developed!
※Patent Pending
Previously, our UCP Series required a UV cure during processing. This is a new, thermosetting material that does not require UV exposure.
■Laser-drilled holes are possible
Planarization is not necessary for surface flattening of innerlayers; direct press and via formation is possible.(Curing can be achieved during pre-preg press process)
■It is possible to adjust the Tg and/or CTE of the UCP Series material based on customer requirements.
Please consult with our sales staff for more information.
■Environmentally responsible product
This material is halogen-free.
| Product No. | Properties | Purpose of use |
|---|---|---|
| UCP-50A-4 | Surface flattening of high gap etc. | Heavy capper board (for inner layer / outer layer) |
| UCP-60 | High Tg type. | PKG, FCPKG, BGA, CSP etc. |